Reminder of Imitation Technology
Precautions for【Imitation Technology】of Creative Coatings
We have filed patent applications not only in Japan but also in major electronic component–producing countries, including Europe, the United States, South Korea, Taiwan, China, Mexico, and Southeast Asian nations. These applications cover methods and apparatuses for forming external electrodes on the terminals of electronic components such as multilayer ceramic capacitors.
The subject of the patent applications defines a blotting process for removing excess paste from the pre-applied paste layers on electronic components. This is achieved by relatively moving a surface plate and a jig holding the electronic component in a combined motion along the X, Y, and Z axes-forward, backward, left, right, and in a spiral pattern-across the surface of the plate.
There are two types of blotting processes defined: one transfers the excess paste onto the surface plate itself (referred to as the "dry method"), and the other transfers the excess paste onto a paste layer pre-formed on the surface plate (referred to as the "wet method").
The methods and apparatuses that implement the blotting process using either the dry or wet method fall within the scope of the inventions claimed in our patent applications. Therefore, we hereby request that you immediately cease any such use.
We take a firm stance against the use of imitative technologies and are committed to eliminating such practices.
To that end, we regularly analyze the cross-sectional electrode structures of electronic components and conduct broad investigations to identify products manufactured using technologies that may imitate our proprietary coating methods.
Should our patent rights be granted and any infringement of those rights be confirmed, we are fully prepared to take legal action without hesitation.
We would be grateful for your continued use and support of our products.
